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A high voltage is applied and the gas is introduced. The positive argon ions go through an acceleration process on the negative cathode and then expel the atoms of the metal plate (evaporating material), which then fall onto the substrates already in the chamber and condense the desired metal coating onto the substrate. The impact of the atoms on the evaporating material produces “Sputtering”, as a result of the acceleration given by the succeeded particles. Unlike many other vacuum deposition techniques, there is no fusion of material, therefore all the metals and alloys can be deposited with high efficiency and control. If a reactive gas such as nitrogen or acetylene is introduced into the chamber together with the process gas, the nitride which reacts to the carbide, develops on the substrates. Different cathodes made of different materials can be inserted in a vacuum coating system to produce multiple layer systems. It is also possible to modify the combination of the single layers by varying the combination of the reactive gases.